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To suppress the high loss of nickel (Ni)/poly(vinylidene fluoride) (PVDF)

while remaining high dielectric constant (k) near the percolation threshold.

In this study, core-shell structured Ni (Ni@NiO) particles were prepared by

heat treatment of raw Ni powder under air atmosphere and incorporated into

PVDF to prepare Ni@NiO/PVDF dielectric composites. The morphological,

dielectric properties and thermal conductivity of the composites are

characterized. The results indicate that compared with the raw Ni reinforced

PVDF composites, the Ni@NiO particles endow PVDF with a high-k and

rather low dissipation factor owing to the presence of NiO shell between Ni

core and PVDF which serves as an interlayer between the Ni cores preventing

them from contacting with each other. Additionally, the Ni@NiO/PVDF

composites still possess a high thermal conductivity. Therefore, the as-prepared

Ni@NiO/PVDF composites possess high-k but low loss, high thermal

conductivity, making them promising for the industrial application as

embedded capacitors.

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