Strengthening mechanisms in equiatomic ultrafine grained AlCoCrCuFeNi high-entropy alloy studied by micro- and nanoindentation methods
<Abstract>
A single phase fcc based nanocrystalline solid solution in equiatomic
AlCoCrCuFeNi high-entropy alloy (HEA) has been synthesized using
ball milling. The milled powders were of “plate-like” morphology and
possessed a precise lattice parameter of 3.641 Å. Compaction of ball milled
powders into bulk components using spark plasma sintering (SPS) at 1023 K
led to the precipitation of ordered bcc (B2). Detailed structural and
microstructural investigations on the sintered alloy indicate the presence
of bimodal grain size distribution with average grain sizes of 112 ± 46 nm
and 1550 ± 500 nm, solid solutions (fcc and B2 phases), dislocations and
twin boundaries. A high hardness value of 6.5 ± 0.1 GPa was measured for
the sample sintered at 1023 K/15 min using Vickers microindentation.
Comprehensive analysis on probable strengthening mechanisms suggests
that frictional stress, Taylor hardening, Hall-Petch strengthening, solid
solution strengthening and twin boundary strengthening mechanisms are
responsible. The Taylor hardening arising from intersection of dislocations
and grain boundary (Hall-Petch) strengthening arising from grain
boundary-dislocation interactions together account for 85% of the observed
flow stress. The Tabor's ratio, (H/σflow) attained a value of 2.7 which is in close
agreement with that for conventional polycrystalline materials.
Nanoindentation at a peak force of 8000 μN yielded a high hardness value
of 8.13 ± 0.15 GPa and an elastic modulus of 172 ± 10 GPa. A low strain rate
sensitivity of 0.0084 and an activation volume of 13 b3 (b is 0.23 nm) were
measured, suggesting that grain boundaries, twin boundaries and interphase
boundaries (fcc/B2) are influential in governing the deformation kinetics.